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Electronic Components & Semiconductors from Shenzhen China

Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl

Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Semiconductor refrigeration TEC1-12706 40*40 CPU electronic refrigerator drink water drinking mechanism Parl
Please use a small battery to test the good or bad after receiving the goods

Chip model: TEC1-12706

External size: 40*40*3.75mm

Internal resistance: 2.1 ~ 2.4Ω (ambient temperature 23 ± 1 ℃, 1kHz AC test)
Maximum temperature difference: △ TMAX (qc = 0) above 59 ℃.
Working current: IMAX = 4.3-4.6A (at 12V)
Rated voltage: 12V (VMAX: 15V startup current 5.8A)
Cold power: QCMAX 60-72W
Working environment: temperature range -55 ℃ ~ 83 ℃ (too high environmental temperature drop directly affects the refrigeration efficiency)
Packaging process: Surrounding standards 704 Silicon Rubber Seal

The side of the word is the cooling surface

The side without words is the heat dissipation surface

The radiator or water cooling heat dissipation device must be installed on the heat sink, otherwise it will be burned.(Note: It should be coated with hot silicon grease regardless of water cooling or cold)

Note: If the cooling films caused by the heat dissipation are not good, our shop is not responsible for warranty.When testing without heat dissipation, the power will have a cooling effect.The power should be unplugged immediately within 1 second."Please test carefully, do not use this method to test this method."

Product Attributes
Brand Other/Other

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$2.02
Price in reward points: 2
  • Stock: In Stock
  • Model: ULFQ1222
  • Weight: 0.01kg

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